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Designcon January 29–31, 2019 Santa Clara Convention Center Santa Clara, CA

DesignCon brings together 5,000 professionals from the high-speed communications and semiconductor industries for three days in Silicon Valley.

Discover the latest technologies and insights via DesignCon's technical 15-track conference program and an expo offering first-looks in electrical components, signal integrity, test and measurement, and more.

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TestConX (formerly BiTS Workshop) - Mesa AZ March 3-6 Hilton Phoenix East/Mesa

TesConX is the preeminent event for what’s Now & Next in the test of pack­aged integrated circuits (ICs). The technical pro­gram and exhibition is dedicated to providing a forum for the latest in­for­mation on a broad range of test topics in­clud­ing final, wafer sort, and burn-in. 

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APEC March 17 - 21 Anaheim Convention Center

APEC 2019 will continue the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. The conference will be held at the Anaheim Convention Center in Anaheim, California.

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USA EOS/ESD Symposium Riverside CA Sep 16-18 Riverside Convention Center

Solve your ESD Challenges-Learn from Industry Experts- Network with all of the top ESD Professionals in every major company. Learn best practices and the newest advances in technology for ESD control, protection, and design. 

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IMS Microwave - Boston MA June 2-7 Boston Convention Center

The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition. Co-located with IMS are the IEEE RFIC and ARFTG conferences.

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ISTFA - Portland OR Nov 10-14 Oregon Convention Center

The advent of Artificial Intelligence and the promise of quantum computing are driving disruptive computing architectures. Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

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