RTI offers sockets & lids covering the standard JEDEC range of packages from 0.35mm - 1.27mm BGA arrays with no limit on package body size. Low-inductance, low-resistance, and high bandwidth solutions featuring pogo pin, elastomeric "rubber socket" contacts.
WLCSP, Flip Chip sockets for die as small as 2mm on standard & custom pitch arrays down to 0.35mm pitch. IR/UV corrected sapphire & quartz lids allowing 100% edge to edge visibility of the die for EMMI, Thermal and Laser test/fault isolation. Contact us for price & lead time
Standard & Custom Sockets with multiple ground contacts to dissipate the heat from your QFN & LGA devices. Standard pitches down to 0.4mm. High current, low-resistance pogo pins to meet your most demanding test application. Bench, DVT, production or Reliability test. Provide POD to obtain price & lead-time.
Open top sockets for CMOS sensors on standard 1.27mm pitch or smaller pitch LGA footprints allow for 100% viewing of your die.
Still debugging your device with external power suppliers and an oscilloscope. We can make it easier on you with custom made break out sockets & fixtures.
RTI Cartridge sockets hold up to 10 die or packages in a single socket allowing for a greater number of ICs on smaller burn-in, HAST or other reliability test boards