RTI offers sockets & lids covering the standard JEDEC range of packages from 0.35mm - 1.27mm BGA arrays with no limit on package body size. Low-inductance, low-resistance, and high bandwidth solutions featuring pogo pin, elastomeric "rubber socket" contacts.
WLCSP, Flip Chip sockets for die as small as 2mm on standard & custom pitch arrays down to 0.35mm pitch. IR/UV corrected sapphire & quartz lids allowing 100% edge to edge visibility of the die for EMMI, Thermal and Laser test/fault isolation. Contact us for price & lead time
Standard & Custom PiSockets with multiple ground contacts to dissipate the heat from your QFN & LGA devices. Standard pitches down to 0.4mm. High current, low-resistance pogo pins to meet your most demanding test application. Bench, DVT, production or Reliability test. Provide POD to obtain price & lead-time.
Reduce handling errors with RTI multi-site sockets in your reliability test applications. Each strip can hold up to ten die or SO packages. Each can be used in burn-in, HAST and other Reliability Test applications without reloading die.
RTI offers sockets for your modules and PCBs up to 4" in length! Making provisions for external RF connections, clearances for other components, castellated solder pads.....NO problem!