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Ultra Tec Manufacturing DPA Tools

Sample Prep/DPA

Enabling the IC FA Engineer through a wide range of IC surface and sample preparation equipment along with accessories and consumables including precision saws, parallel, end-and-edge and selected area milling/polishing stations.

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Selected Area Milling & Polishing

ASAP-InSitu

5-Axis CNC Mill for Selected Area Sample Prep. 

  •  Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning 
  •  Import Overlays – use X-RAY, C-SAM images to improve targeting 
  • Thermal stage to flatten BGAs
  • Curvature correction stage
  • Automated End-Pointing

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Ultra Tec Parallel Polishing/Lapping

Ultrapol Advance

 Flat Lapping and Polishing Machine

  •  Better processing results –  ULTRACOLLIMATOR  
  •  Fast & repeatable alignment 
  •  Slurry polishing 
  •  Avoids cross-contamination 

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Ultra Tec IC Edge Grinding & Polishing

Ultrapol End & Edge

 Flat Lapping and Polishing Machine

  •  Combination parallel and end-and-edge grinding & polishing  
  •  Quick Release sample holder compatible with most SEMS/FIBS 
  •  Wedge angles for fiber optics

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Ultra Tec Precision Saws

Ultraslice Saws

Versatile Precision saw for small benches

  •  Long Cuts & Dicing  
  •  Accuracy – precision lead screws on all feed directions 
  •  Multiple Blade Types – a wide range of diamond and abrasive blades is available. 

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