Sample Prep/DPA

Enabling the IC FA Engineer through a wide range of IC surface and sample preparation equipment along with accessories and consumables including precision saws, parallel, end-and-edge and selected area milling/polishing stations.

5-Axis CNC Mill for Selected Area Sample Prep. 

•  Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning 
•  Import Overlays – use X-RAY, C-SAM images to improve targeting 
• Thermal stage to flatten BGAs
• Curvature correction stage
• Automated End-Pointing

 Flat Lapping and Polishing Machine

•  Better processing results –  ULTRACOLLIMATOR  
•  Fast & repeatable alignment 
•  Slurry polishing 
•  Avoids cross-contamination 
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 Flat Lapping and Polishing Machine

•  Combination parallel and end-and-edge grinding & polishing  
•  Quick Release sample holder compatible with most SEMS/FIBS 
•  Wedge angles for fiber optics

Versatile Precision saw for small benches

•  Long Cuts & Dicing  
•  Accuracy – precision lead screws on all feed directions 
•  Multiple Blade Types – a wide range of diamond and abrasive blades is available.